Projecting apparatus

ABSTRACT

A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims priority to the U.S. Provisional PatentApplication Ser. No. 63/031,589 filed on May 29, 2020, the U.S.Provisional Patent Application Ser. No. 63/031,594 filed on May 29,2020, the U.S. Provisional Patent Application Ser. No. 63/031,593 filedon May 29, 2020, the U.S. Provisional Patent Application Ser. No.63/031,592 filed on May 29, 2020, which application are incorporatedherein by reference in its entirety.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a projecting apparatus, and moreparticularly to a projecting apparatus having a microelectromechanicalsystems (MEMS) module.

BACKGROUND OF THE DISCLOSURE

A conventional projecting apparatus having a MEMS module includes aframe and a collimator lens that is usually fixed to the frame byadhesives through multi-point fixing. However, the adhesives havedifferent amounts of shrinkage after solidification, which easily causesthe collimator lens fixed by the adhesives to offset along differentdirections corresponding to the adhesives.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacy, the presentdisclosure provides a projecting apparatus to effectively improve on theissues associated with conventional projecting apparatuses.

In one aspect, the present disclosure provides a projecting apparatus,which includes a frame, a light source module, at least one collimatorlens, at least one adhesive, and a microelectromechanical systems (MEMS)module. The frame includes a first frame portion and a second frameportion. The first frame portion has a carrier and a carrying bridge. Anend of the carrying bridge is connected to the carrier, the frame has aprocessing slot using the carrying bridge as a bottom thereof, and thecarrying bridge has at least one thru-hole that is in spatialcommunication with the processing slot. The second frame portion isconnected to the carrier and another end of the carrying bridge of thefirst frame portion. The frame has a light channel that allows the firstframe portion and the second frame portion to be in spatialcommunication with each other. The light source module is disposed onthe carrier. The at least one collimator lens is located in theprocessing slot and corresponds in position to the light source module.The at least one adhesive corresponds in position to the at least onethru-hole. The at least one collimator lens is adhered and fixed to thecarrying bridge through the at least one adhesive. The MEMS module isdisposed on the second frame portion and is configured to transmit lightthat is emitted from the light source module and that travels throughthe light channel.

Therefore, the at least one collimator lens of the projecting apparatusin the present disclosure is adhered and fixed to the carrying bridgethrough the at least one adhesive, and based on a volume and a shrinkagedirection of the at least one adhesive being predictable, an offset ofthe at least one adhesive caused by the shrinkage can be controlled forfacilitating to increase an assembling precision of the at least onecollimator lens.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The described embodiments may be better understood by reference to thefollowing description and the accompanying drawings, in which:

FIG. 1 is a perspective view of a projecting apparatus according to anembodiment of the present disclosure;

FIG. 2 is a perspective view of FIG. 1 from another angle of view;

FIG. 3 is an exploded view of FIG. 1 where an adhesive, a first fixingcolloid, and a second colloid are omitted;

FIG. 4 is an exploded view of FIG. 2 where the adhesive, the firstfixing colloid, and the second colloid are omitted;

FIG. 5 is a perspective view showing a frame of FIG. 3;

FIG. 6 is a perspective view showing the frame of FIG. 4;

FIG. 7 is a perspective cross-sectional view of FIG. 1 along across-sectional plane;

FIG. 8 shows an enlarged view of part VIII of FIG. 7;

FIG. 9 is a perspective cross-sectional view of FIG. 1 along a lightcombining plane;

FIG. 10 is an exploded view showing a light source module and aphotodetector module of FIG. 3;

FIG. 11 is an exploded view showing the light source module and thephotodetector module of FIG. 4;

FIG. 12 is a cross-sectional view taken along line XII-XII of FIG. 3;

FIG. 13 is an exploded view showing a microelectromechanical systems(MEMS) module of the projecting apparatus according to the embodiment ofthe present disclosure when the first fixing colloid and the secondfixing colloid are omitted;

FIG. 14 is a cross-sectional view taken along line XIV-XIV of FIG. 1;and

FIG. 15 is a perspective view showing the projecting apparatus appliedto a pair of smart glasses according to the embodiment of the presentdisclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

Referring to FIG. 1 to FIG. 15, an embodiment of the present disclosureprovides a projecting apparatus 100. As shown in FIG. 1, FIG. 2, andFIG. 15, the projecting apparatus 100 in the present embodiment isapplied to a pair of smart glasses 1000 (e.g., the projecting apparatus100 is assembled to an eyeglass temple 201 of an eyeglass frame 200),which can be a pair of augmented reality (AR) glasses, but the presentdisclosure is not limited thereto. As shown in FIG. 2 to FIG. 4, theprojecting apparatus 100 includes a frame 1, a light source module 2, aplurality of collimator lenses 3, a plurality of adhesives 4 (as shownin FIG. 7), a light combining lens 5, a photodetector module 6, and amicroelectromechanical systems (MEMS) module 7. The followingdescription describes the structural and connection relationship of eachcomponent of the projecting apparatus 100 of the present embodiment.

It should be noted that the projecting apparatus 100 in the presentembodiment is described having the above components, but the presentdisclosure is not limited thereto. For example, in other embodiments ofthe present disclosure not shown in the drawings, the photodetectormodule 6 can be omitted; or, each of a quantity of the collimator lenses3 and a quantity of the adhesives 4 can be at least one, and the lightcombining lens 5 and the photodetector module 6 can be omitted; or, thecollimator lenses 3, the adhesives 4, the light combining lens 5, andthe photodetector module 6 can be omitted.

In the present embodiment, as shown in FIG. 5 and FIG. 6, the frame 1 isintegrally formed as a single one-piece structure, and corners of theframe 1 jointly define a distribution space S that is preferably in acuboid shape, but the present disclosure is not limited thereto.

Moreover, as shown in FIG. 3 and FIG. 5, a part of the light sourcemodule 2 (e.g., a complex light emitter 22 and a heat sink 23 describedin the following description), the light combining lens 5, thecollimator lenses 3, the adhesives 4, the photodetector module 6, and apart of the MEMS module 7 (e.g., a first MEMS unit 72 and a second MEMSunit 73 described in the following description) can be located in thedistribution space S by at least part of structural designs of the frame1 of the present embodiment, thereby properly arranging the componentsof the projecting apparatus 100 to effectively control a shape and avolume of the projecting apparatus 100, but the present disclosure isnot limited thereto.

As shown in FIG. 5 and FIG. 6, the frame 1 includes a first frameportion 11 and a second frame portion 12 that is connected to the firstframe portion 11. The frame 1 has a light channel 13 (as shown in FIG.9) that allows the first frame portion 11 and the second frame portion12 to be in spatial communication with each other. In the presentembodiment, a same side for both the first frame portion 11 and thesecond frame portion 12 (e.g., a rear left side of the frame 1 shown inFIG. 5) is defined as a user side S1, and another side for both thefirst frame portion 11 and the second frame portion 12 (e.g., a frontright side of the frame 1 shown in FIG. 5) is defined as a heatdissipating side S2.

It should be noted that when the projecting apparatus 100 is applied tothe pair of smart glasses 1000 (as shown in FIG. 15) worn by a user, aside of the projecting apparatus 100 adjacent to the user is the userside S1, and the heat dissipating side S2 of the projecting apparatus100 is opposite to the user side S1, but the present disclosure is notlimited thereto.

As shown in FIG. 5 and FIG. 6, the first frame portion 11 includes acarrier 111 and a carrying bridge 112. An end of the carrying bridge 112is connected to the carrier 111, and another end of the carrying bridge112 is connected to the second frame portion 12. The carrier 111includes an end board 1111 that is arranged away from the second frameportion 12, a first seat 1112, and a second seat 1113. Each of the firstseat 1112 and the second seat 1113 is connected to the end board 1111and the second frame portion 12. The second frame portion 12 and the endboard 1111 are respectively connected to the two ends of the carryingbridge 112, and the first seat 1112 and the second seat 1113 are locatedbetween the second frame portion 12 and the end board 1111.

Moreover, the frame 1 has a processing slot 14 using the carrying bridge112 as a bottom thereof, and the first seat 1112 and the second seat1113 are respectively located at two opposite sides of the processingslot 14. In other words, as shown in FIG. 7 and FIG. 8, a bottom side ofthe frame 1 is configured to allow any one of the collimator lenses 3 tobe inserted into the processing slot 14 along a straight direction forbeing arranged adjacent to the carrying bridge 112.

Specifically, as shown in FIG. 5 to FIG. 8, the carrying bridge 112 hasa plurality of thru-holes 1121 that are in spatial communication withthe processing slot 14. Any one of the thru-holes 1121 has an apertureD₁₁₂₁. The carrying bridge 112 has a plurality of channel walls 1122that are arranged on the bottom of the processing slot 14 and that arerespectively connected to walls of the thru-holes 1121.

Moreover, the carrying bridge 112 has a plurality of receiving slots1123 that are recessed in a surface thereof (e.g., a top surface of thecarrying bridge 112 shown in FIG. 8) away from the processing slot 14and that are spaced apart from each other, and each of the thru-holes1121 is recessed in a bottom of one of the receiving slots 1123. In thepresent embodiment, a center of the bottom of any one of the receivingslots 1123 does not overlap with a center of the corresponding thru-hole1121, but the present disclosure is not limited thereto.

The second frame portion 12 includes a partition 121 that is connectedto the first frame portion 11, two lateral boards 122 that arerespectively connected to two opposite sides of the partition 121, and atransverse beam 123 that is arranged away from the partition 121 andthat connects to the two lateral boards 122. The partition 121 in thepresent embodiment is connected to a corresponding one of the two endsof the carrying bridge 112 and has the light channel 13. The two lateralboards 122 are respectively located at the user side S1 and the heatdissipating side S2, and each of the two lateral boards 122 has aguiding slot 1221 recessed in a portion thereof adjacent to the firstframe portion 11.

Specifically, the two guiding slots 1221 correspond in position to eachother and obliquely extend along a direction gradually away from thepartition 121 or the first frame portion 11. Two ends of the transversebeam 123 are respectively connected to bottom corners of the two lateralboards 122 away from the first frame portion 11. In addition, innersides of the two lateral boards 122 respectively have two retainingstructures 1222 that face each other and are arranged adjacent to thetransverse beam 123.

As shown in FIG. 3, FIG. 9, and FIG. 10, the light source module 2 isdisposed on the carrier 111 (e.g., the first seat 1112) and defines aplurality of optical axes L. The light source module 2 includes a lightcontrolling flexible board 21, a complex light emitter 22 that isdisposed on the light controlling flexible board 21, and a heat sink 23that is connected to the complex light emitter 22. Moreover, the complexlight emitter 22 is disposed on the first frame portion 11 and definesthe optical axes L, and the heat sink 23 is located at the heatdissipating side S2 of the frame 1, thereby facilitating to rapidlydissipate heat energy generated from the complex light emitter 22.

Specifically, as shown in FIG. 10 to FIG. 12, the complex light emitter22 includes a plurality of light emitting units 221 that respectivelydefine the optical axes L, a plurality of signal pads 222 that areelectrically coupled to the light emitting units 221, and at least oneheat dissipating pad 223. The signal pads 222 of the complex lightemitter 22 are assembled to the light controlling flexible board 21, sothat the light controlling flexible board 21 is electrically coupled tothe light emitting units 221 through the signal pads 222.

Moreover, the light controlling flexible board 21 has at least oneaccommodating hole 211. The heat sink 23 includes a flat portion 231 andat least one heat conductive portion 232 that protrudes from the flatportion 231. The flat portion 231 is fixed to (e.g., adhered to) thelight controlling flexible board 21, and the at least one heatconductive portion 232 is connected to the at least one heat dissipatingpad 223 by passing through the at least one accommodating hole 21, sothat the heat energy generated from the complex light emitter 22 can berapidly transmitted to the heat sink 23 directly through the at leastone heat dissipating pad 223.

In the present embodiment, the at least one heat conductive portion 232and a wall of the at least one accommodating hole 211 preferably have agap G there-between, so that the heat energy received by the at leastone heat conductive portion 232 can be rapidly transmitted to the flatportion 231. In other words, any heat dissipating component providedwithout any gap surrounding a heat conductive portion thereof isdifferent from the heat sink 23 of the present embodiment.

It should be noted that the complex light emitter 22 in the presentembodiment is a three-in-one emitter with a single chip type forreducing volume of the projecting apparatus 100, but the presentdisclosure is not limited thereto. For example, in other embodiments ofthe present disclosure not shown in the drawings, the light sourcemodule 2 can include a light controlling flexible board 221 and aplurality of light emitting units 221 that are assembled to the lightcontrolling flexible board 221 and that respectively define the opticalaxes L, in which the light emitting units 221 are not integrated in onechip and are separate from each other.

As shown in FIG. 8 and FIG. 9, the collimator lenses 3 are located inthe processing slot 14 of the frame 1 and correspond in position to thelight source module 2 (e.g., the collimator lenses 3 are spaced apartfrom each other and are respectively located on the optical axes L). Thecollimator lenses 3 are arranged in the processing slot 14 by passingthrough the bottom side of the frame 1, so that the collimator lenses 3can be arranged adjacent to the carrying bridge 112 and can respectivelycorrespond in position to the thru-holes 1121.

Specifically, the collimator lenses 3 respectively face toward thechannel walls 1122 of the carrying bridge 112, and each of the channelwalls 1122 and the corresponding collimator lens 3 jointly define acapillary channel C being in spatial communication with thecorresponding thru-hole 1121 (e.g., the capillary channel C is in asubstantial semi-circular arc shape). In the present embodiment, each ofthe channel walls 1122 corresponds in shape to the correspondingcollimator lens 3, so that the capillary channels C have a same widthWc, but the present disclosure is not limited thereto.

As shown in FIG. 7 and FIG. 8, the adhesives 4 are spaced apart fromeach other and respectively correspond in position to the thru-holes1121, and each of the adhesives 4 is filled within one of the capillarychannels C, so that each of the collimator lenses 3 can be adhered andfixed to the carrying bridge 112 through one of the adhesives 4.Specifically, the adhesives 4 are respectively arranged in the receivingslots 1123, and then each of the adhesives 4 gradually flows into thecorresponding thru-hole 1121 by gravity and further fills into thecorresponding capillary channel C by the capillary phenomenon.

Accordingly, the adhesives 4 can be controlled to have substantially thesame volume and can have the same shrinkage direction (e.g., a directiontoward the carrying bridge 112) when being solidified, such that anoffset of each of the adhesives 4 caused by the shrinkage can becontrolled for facilitating to increase an assembling precision of thecorresponding collimator lens 3.

As shown in FIG. 3 and FIG. 9, the light combining lens 5 is disposed onthe first frame portion 11 (e.g., the second seat 1113 of the carrier111) and located on the optical axes L of the light source module 2. Thecollimator lenses 3 are located between the light source module 2 andthe light combining lens 5. The light combining lens 5 defines a lightcombining path B passing through the light channel 13.

It should be noted that the light combining lens 5 in the presentembodiment is a single one-piece structure, but the specific structureof the light combining lens 5 can be adjusted or changed according todesign requirements. For example, in other embodiments of the presentdisclosure not shown in the drawings, the light combining lens 5 caninclude a plurality of lenses spaced apart from each other. Furthermore,in one embodiment of the present disclosure not shown in the drawings,the light combining lens 5 can be omitted, and each of a quantity of thethru-holes 1121, a quantity of the collimator lens 3, and a quantity ofthe adhesives 4 can be at least one. Specifically, the at least oneadhesive 4 corresponds in position to the at least one thru-hole 1121,and the at least one collimator lens 3 is located in the processing slot14 and is adhered and fixed to the carrying bridge 112 through the atleast one adhesive 4. Accordingly, the volume and the shrinkagedirection of the at least one adhesive 4 are predictable, such that anoffset of the at least one adhesive 4 caused by the shrinkage can becontrolled for facilitating to increase an assembling precision of theat least one collimator lens 3.

The photodetector module 6 is disposed on the carrier 111 (e.g., thesecond seat 1113), and the light combining lens 5 is located between thephotodetector module 6 and the collimator lenses 3. The photodetectormodule 6 is configured to receive light that is emitted from the lightsource module 2 and that travels through the light combining lens 5 andat least one of the collimator lenses 3. Specifically, the lightcontrolling flexible board 21 is electrically coupled to thephotodetector module 6, and the light controlling flexible board 21 isconfigured to adjust a lighting intensity of at least one of the lightemitting units 221 according to the light received by the photodetectormodule 6, but the present disclosure is not limited thereto.

In addition, the optical axes L and the light combining path B jointlydefine a light combining plane P1 (e.g., a cross-sectional plane shownin FIG. 9), and the MEMS module 7 is configured to reflect light, whichtravels along the light combining path B, at a light transmitting planeP2 (e.g., a cross-sectional plane shown in FIG. 14). In the presentembodiment, the light combining plane P1 and the light transmittingplane P2 have an angle there-between that is within a range from 85degrees to 95 degrees (e.g., the angle can be 90 degrees), so that thecomponents of the projecting apparatus 100 can be properly arranged inthe distribution space S of the frame 1 to effectively control the shapeand volume of the projecting apparatus 100.

As shown in FIG. 9, the MEMS module 7 is disposed on the second frameportion 12 and is configured to transmit light that is emitted from thelight source module 2 and that travels through the light channel 13 (orthe light combining path B). As shown in FIG. 2, FIG. 3, FIG. 13, andFIG. 14, the MEMS module 7 includes a flexible circuit board 71, a firstMEMS unit 72 and a second MEMS unit 73 that are both connected to theflexible circuit board 71, two first fixing colloids 74 that fix thefirst MEMS unit 72 onto the second frame portion 12, a second fixingcolloid 75 that fixes the second MEMS unit 73 onto the second frameportion 12, and a reflector 76 that corresponds in position to thesecond MEMS unit 73. In addition, components of the MEMS module 7 can befurther added or reduced according to design requirements and are notlimited by the present embodiment.

In the present embodiment, the flexible circuit board 71 includes a mainportion 711 and an extension portion 712 that is connected to the mainportion 711. The main portion 711 covers an outer side of one of the twolateral boards 122 (e.g., the lateral board 122 located at the user sideS1), and the extension portion 712 curvedly extends from the mainportion 711 and is connected to the first MEMS unit 72 and the secondMEMS unit 73.

Moreover, the first MEMS unit 72 is inserted into the guiding slots 1221of the two lateral boards 122, the second MEMS unit 73 abuts against thetwo lateral boards 122 (e.g., the retaining structures 1222) and/or thetransverse beam 123, so that the first MEMS unit 72 and the second MEMSunit 73 can have a predetermined angle α there-between by the secondframe portion 12.

Accordingly, the MEMS module 7 in the present embodiment is provided byassembling the first MEMS unit 72 and the second MEMS unit 73 to theframe 1 having a higher forming dimension (e.g., the frame 1 can beformed in a molding manner), thereby precisely controlling thepredetermined angle α between the first MEMS unit 72 and the second MEMSunit 73.

Specifically, as shown in FIG. 2 and FIG. 13, the first MEMS unit 72includes a first carrying board 721 and a first MEMS member 722 that isassembled to the first carrying board 721. Two lateral portions of thefirst carrying board 721 are respectively inserted into the guidingslots 1221 of the two lateral boards 122, and the two first fixingcolloids 74 are respectively located in the guiding slots 1221 of thetwo lateral boards 122. In the MEMS module 7 of the present embodiment,each of the guiding slots 1221 of the two lateral boards 122 isconnected to a corresponding portion of the first MEMS unit 72 (e.g.,one of the two lateral portions of the first MEMS member 721) fixedtherein through one of the two first fixing colloids 74. Moreover, thefirst MEMS member 722 is connected to the flexible circuit board 71(e.g., a portion of the flexible circuit board 71 abuts against thefirst carrying board 721 and is electrically coupled to the first MEMSmember 722).

The second MEMS unit 73 includes a second carrying board 731 and asecond MEMS member 732 that is assembled to the second carrying board731. The first carrying board 721 and the second carrying board 731 arespaced apart from each other, the second carrying board 731 abutsagainst the two lateral boards 122 (e.g., the retaining structures 1222)and/or the transverse beam 123, and the MEMS module 7 in the presentembodiment uses the second fixing colloid 75 to fix (or adhere) thesecond MEMS unit 73 (e.g., the second carrying board 731) onto thetransverse beam 123, but the present disclosure is not limited thereto.Moreover, the second MEMS member 732 is connected to the flexiblecircuit board 71 (e.g., another portion of the flexible circuit board 71abuts against the second carrying board 731 and is electrically coupledto the second MEMS member 732).

Accordingly, as shown in FIG. 14, a micro-mirror 7221 of the first MEMSmember 722 and a micro-mirror 7321 of the second MEMS member 732 in thepresent embodiment can have the predetermined angle α there-between byusing the first carrying board 721 and the second carrying board 731 tobe in cooperation with the second frame portion 12.

It should be noted that the MEMS module 7 in the present embodiment isprovided with the two first fixing colloids 74 and the second fixingcolloid 75 to fix the first MEMS unit 72 and the second MEMS unit 73onto the second frame portion 12, thereby further increasing precisionof the predetermined angle α, but the present disclosure is not limitedthereto. For example, in other embodiments of the present disclosure notshown in the drawings, the first MEMS unit 72 and the second MEMS unit73 can be fixed onto the second frame portion 12 in other manners (e.g.,an engaging manner or a screwing manner).

Beneficial Effects of the Embodiment

In conclusion, the at least one collimator lens of the projectingapparatus in the present disclosure is adhered and fixed to the carryingbridge through the at least one adhesive, and based on the volume andthe shrinkage direction of the at least one adhesive being predictable,an offset of the at least one adhesive caused by the shrinkage can becontrolled for facilitating to increase an assembling precision of theat least one collimator lens.

Moreover, the MEMS module of the projecting apparatus in the presentdisclosure is provided by assembling the first MEMS unit and the secondMEMS unit to the frame having a higher forming dimension, therebyprecisely controlling the predetermined angle between the first MEMSunit and the second MEMS unit.

Furthermore, in the projecting apparatus of the present disclosure, atleast one heat conductive portion is connected to the at least one heatdissipating pad by passing through the at least one accommodating hole,so that the heat energy generated from the complex light emitter can berapidly transmitted to the heat sink directly through the at least oneheat dissipating pad. Accordingly, the heat dissipating efficiency ofthe light source module can be increased.

In addition, the components of the projecting apparatus of the presentdisclosure are arranged on the light combining plane and the lighttransmitting plane, which have an angle there-between that is within arange from 85 degrees to 95 degrees, so that the components of theprojecting apparatus can be properly arranged in the frame toeffectively control the shape and volume of the projecting apparatus.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A projecting apparatus, comprising: a frameincluding: a first frame portion having a carrier and a carrying bridge,wherein an end of the carrying bridge is connected to the carrier, theframe has a processing slot that uses the carrying bridge as a bottomthereof, and the carrying bridge has at least one thru-hole that is inspatial communication with the processing slot; and a second frameportion connected to the carrier and another end of the carrying bridgeof the first frame portion, wherein the frame has a light channel thatallows the first frame portion and the second frame portion to be inspatial communication with each other; a light source module disposed onthe carrier; at least one collimator lens located in the processing slotand corresponding in position to the light source module; at least oneadhesive corresponding in position to the at least one thru-hole,wherein the at least one collimator lens is adhered and fixed to thecarrying bridge through the at least one adhesive; and amicroelectromechanical systems (MEMS) module disposed on the secondframe portion and configured to transmit light that is emitted from thelight source module and that travels through the light channel.
 2. Theprojecting apparatus according to claim 1, wherein each of a quantity ofthe at least one thru-hole, a quantity of the at least one collimatorlens, and a quantity of the at least one adhesive is more than one,wherein the adhesives are spaced apart from each other and respectivelycorrespond in position to the thru-holes, and each of the collimatorlenses is adhered and fixed to the carrying bridge through one of theadhesives, wherein the light source module defines a plurality ofoptical axes, and the collimator lenses are spaced apart from each otherand are respectively located on the optical axes, wherein the projectingapparatus further includes a light combining lens disposed on the firstframe portion and located on the optical axes of the light sourcemodule, and wherein the collimator lenses are located between the lightsource module and the light combining lens, and the light combining lensdefines a light combining path that passes through the light channel. 3.The projecting apparatus according to claim 2, wherein the carryingbridge includes a plurality of channel walls that respectively face thecollimator lenses and that are respectively connected to walls of thethru-holes, and wherein each of the channel walls and the correspondingcollimator lens jointly define a capillary channel being in spatialcommunication with the corresponding thru-hole, and each of theadhesives is filled within one of the capillary channels.
 4. Theprojecting apparatus according to claim 3, wherein each of the channelwalls corresponds in shape to the corresponding collimator lens, so thatthe capillary channels have a same width.
 5. The projecting apparatusaccording to claim 2, wherein the carrying bridge has a plurality ofreceiving slots recessed in a surface thereof away from the processingslot, and each of the thru-holes is recessed in a bottom of one of thereceiving slots.
 6. The projecting apparatus according to claim 5,wherein a center of the bottom of any one of the receiving slots doesnot overlap with a center of the corresponding thru-hole.
 7. Theprojecting apparatus according to claim 2, further comprising aphotodetector module disposed on the carrier, wherein the lightcombining lens is located between the photodetector module and thecollimator lenses, and wherein the photodetector module is configured toreceive light that is emitted from the light source module and thattravels through the light combining lens and at least one of thecollimator lenses.
 8. The projecting apparatus according to claim 7,wherein the light source module includes a light controlling flexibleboard and a plurality of light emitting units that are assembled ontothe light controlling flexible board, wherein the light controllingflexible board is electrically coupled to the photodetector module, andthe light emitting units respectively define the optical axes, andwherein the light controlling flexible board is configured to adjust alighting intensity of at least one of the light emitting units accordingto the light received by the photodetector module.
 9. The projectingapparatus according to claim 2, wherein the optical axes and the lightcombining path jointly define a light combining plane, and the MEMSmodule is configured to reflect light, which travels along the lightcombining path, at a light transmitting plane, and wherein the lightcombining plane and the light transmitting plane have an anglethere-between that is within a range from 85 degrees to 95 degrees. 10.The projecting apparatus according to claim 2, wherein the light sourcemodule includes: a light controlling flexible board having at least oneaccommodating hole; a complex light emitter disposed on the carrier anddefining the optical axes, wherein the complex light emitter includes atleast one heat dissipating pad and a plurality of signal pads, andwherein the signal pads are assembled to the light controlling flexibleboard; and a heat sink having a flat portion and at least one heatconductive portion that protrudes from the flat portion, wherein theflat portion is fixed to the light controlling flexible board, and theat least one heat conductive portion is connected to the at least oneheat dissipating pad that passes through the at least one accommodatinghole.
 11. The projecting apparatus according to claim 10, wherein the atleast one heat conductive portion and a wall of the at least oneaccommodating hole have a gap there-between.
 12. The projectingapparatus according to claim 10, wherein a same side for both the firstframe portion and the second frame portion is defined as a user side,another side for both the first frame portion and the second frameportion is defined as a heat dissipating side, and the heat sink islocated at the heat dissipating side.
 13. The projecting apparatusaccording to claim 10, wherein the complex light emitter furtherincludes a plurality of light emitting units that respectively definethe optical axes and that are electrically coupled to the signal pads.14. The projecting apparatus according to claim 2, wherein the carrierincludes: an end board, wherein the second frame portion and the endboard are respectively connected to the two ends of the carrying bridge;a first seat connected to and located between the end board and thesecond frame portion, wherein the light source module is disposed on thefirst seat; and a second seat connected to and located between the endboard and the second frame portion, wherein the light combining lens isdisposed on the second seat; wherein the first seat and the second seatare respectively located at two opposite sides of the processing slot.15. The projecting apparatus according to claim 2, wherein the frame isintegrally formed as a single one-piece structure, and corners of theframe jointly define a distribution space, and wherein a part of thelight source module, the light combining lens, the collimator lenses,the adhesives, and a part of the MEMS module are located in thedistribution space.